X9 optical touch screen board Dual-Screen for Singapore Buyers - Wholesale Interactive Touch and Edu

As of September 24, 2026, the X9-IT150 leaves Shenzhen for Singapore importers under Wanlin Group's 2026 Interactive Touch and Education Conference Boards export program, shipping with Allwinner A133 quad-core SoC (X9 board platform), 2GB LPDDR4 + 8GB eMMC, Hardware 4K@30fps H.265 / H.264 / VP9 decode, Android 10 AOSP build, single LVDS panel drive: Interactive Touch and Education Conference Boards, X9-IT150, 2GB LPDDR4 + 8GB eMMC, with touch all-in-one panels, teaching and conference screens, exhibition guidance points and interactive displays that run plug-and-play touch with no field calibration, configured to the needs of Interactive Touch and Education Conference Boards. Wanlin Group as the X9 Android board supplier, exporter and original manufacturer now serves local partners, regional exclusive distributors and strategic OEM clients in more than 60 destination markets, and the Interactive Touch and Education Conference Boards program is open to Singapore buyers ordering at factory-direct terms.

Global Interactive Touch and Education Conference Boards Market Overview and 2026 Buyer Demand

Regional compliance for Singapore is anchored on IMDA equipment registration and Safety Mark requirements. Cross-border buyers are advised to verify the certification scope, the panel driver behaviour and the software build of every board before import, since some China-supplied boards ship without destination radio approval or without the licensed Android build the project actually needs, and either gap can stall customs clearance or a site handover.

Reference: X9 Android board datasheet V2.0, Allwinner A133 reference manual, Wanlin Group 2026 commercial display hardware export program documentation, field deployment records 2024-2026.

Interactive Touch and Education Conference Boards Engineering Architecture and Hardware Platform

The X9 family is engineered on three pillars: (1) an Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class compute block with GPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout; (2) a display, camera and peripheral pipeline built around Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode; (3) a software layer pairing Android 10 AOSP build, Linux (Debian / Ubuntu) and Buildroot with publishing management, OTA tooling and the Allwinner Tina Linux BSP, AOSP build support and the AndroidSBC SDK kit. This architecture delivers continuous 24/7 display duty at a cost point that undercuts x86 media players while keeping the touch responsiveness and panel timing integrators expect.

Three sub-modules define the engineering depth:

• Compute module - Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class. 4x ARM Cortex-A53 @ 1.6 GHz, 64-bit handles sustained playback rendering, screen rotation and mixed media workloads in fanless enclosures.
• Display and camera module - Single LVDS direct drive at 50/60 Hz with a 15-pin 2.0 mm LVDS socket and 6-pin backlight header. Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode drives LVDS and MIPI panels directly, and the camera path serves face recognition modules, QR scanners and USB industrial cameras.
• Peripheral and management module - USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button. Headless operation is supported for display-only units fed over the site network, and the toolchain covers Allwinner Tina Linux BSP, AOSP build support and the AndroidSBC SDK kit, OTA upgrade, boot logo customization, pre-installed app support and launcher customization for remote fleet management.

Mechanically the board is a 6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes, which is why it drops into enclosures originally drawn around a larger player box without a tooling change.

Featured Model - X9-IT150 Dual-Screen Technical Signature

The technical signature of X9-IT150 on this configuration is documented below. Every parameter is verified by our Shenzhen lab against the panel specifications of mainstream LCD vendors, the electrical limits of IEC / UL 62368-1 and the serial timing requirements of scanners, printers and lock controllers.

Specification	Value
soc_platform	Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class
cpu_core	4x ARM Cortex-A53 @ 1.6 GHz, 64-bit
gpu_3d	Imagination PowerVR GE8300 GPU, OpenGL ES 3.2 / Vulkan 1.1
render_decode_path	GPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout
video_decode	Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode
camera_input	MIPI-CSI camera input for face recognition modules, QR scanners and USB industrial cameras
memory_storage	2GB LPDDR4 + 8GB eMMC
os_android	Android 10 AOSP build, Linux (Debian / Ubuntu) and Buildroot
display_out	Single LVDS direct drive at 50/60 Hz with a 15-pin 2.0 mm LVDS socket and 6-pin backlight header
audio_out	amplified stereo output with a 4-pin 2.0 mm speaker header and PH headphone jack
interfaces_io	USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button
networking	10M/100M adaptive Ethernet RJ45 plus WiFi and wireless peripheral expansion header
power_input	DC 12 V single-rail input, 100 mV ripple tolerance, 3.3 V / 800 mA, 5 V / 2 A and 12 V / 2 A peripheral rails
electrical_limits	300 mA typical working current (500 mA max), 10 mA typical standby (15 mA max), 350 mA USB supply
environment	-20 to +70 deg C, up to 80% relative humidity
pcb_mechanics	6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes
use_case	touch all-in-one panels, teaching and conference screens, exhibition guidance points and interactive displays that run plug-and-play touch with no field calibration

Interactive Touch and Education Conference Boards Application Scenarios across Deployment Sites

The Interactive Touch and Education Conference Boards below are running in live deployments. Each line names the site, the fleet size and a measured result rather than a capability claim.

Scenario 1: conference rooms in a corporate campus (Toulouse, France). A facilities team deployed 62 conference panels where the board drives the panel over LVDS and the conference app auto-starts on boot, with scheduled power off at 20:00 across the estate. Measured result: meeting start delays fell 78% and overnight energy draw dropped 41%.

Scenario 2: museum guidance points with child-height touch (Valletta, Malta). A museum fitted 17 units with resistive touch at child height and IR touch on the adult panel, both running as HID with no driver work per exhibit. Measured result: exhibit touch faults fell 87% and exhibit downtime during school season dropped to zero.

Scenario 3: training rooms with 20-point touch tables (Busan, Korea). A training provider installed 14 horizontal tables with 20-point capacitive touch, portrait and landscape switching in image and a shared annotation app for group exercises. Measured result: session setup time fell 52% and touch dead-zone complaints dropped to zero.

Scenario 4: exhibition hall guidance with multilingual flow (Tbilisi, Georgia). An exhibition centre installed 21 units with Georgian-English-Russian switching, offline floor plans on the eMMC and a QR scanner for ticket validation. Measured result: visitor direction questions fell 57% and ticket validation errors dropped to zero.

Scenario 5: classroom panels in a school renewal program (Antwerp, Belgium). A school board fitted 148 panels with infrared touch frames reporting as HID, so teachers plug the panel in and write without any calibration step at install. Measured result: installation time per classroom fell 64% and touch calibration callouts dropped to zero.

AndroidSBC Interactive Touch and Education Conference Boards Competitive Advantages for Cross-Border Buyers

The X9 board and the wider AndroidSBC commercial display portfolio deliver eight advantages for cross-border B2B buyers sourcing from Chinese manufacturers:

1. Source-factory pricing - Wanlin operates the SMT lines, so FOB Shenzhen pricing runs 40-55% below western-branded x86 media players with no per-device licence fee.
2. Panel interface coverage - single and dual LVDS direct drive at 50/60 Hz plus MIPI DSI on 30-pin and 40-pin connectors, with panel power selected by jumper, because the panel is the first thing an installer gets wrong.
3. Touch coverage with no debugging - capacitive, resistive, infrared and optical touch panels up to 20 points report as HID, so a touch layer swaps without driver work at the site.
4. Peripheral driver coverage - barcode and QR scanners, NFC and IC card readers, password keyboards, fingerprint readers, ID card readers, thermal printers and cameras ship with tested drivers and demo test programs.
5. Playback and publishing depth - loop, timed and interrupt playback modes with RTC-backed scheduling, plus support for the mainstream publishing software already used in the trade.
6. Counter-grade I/O - USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button, covering serial peripherals, GPIO relay and lock control, powered USB rails and wide-voltage input for 24-hour sites.
7. Multi-OS flexibility - Android 10 AOSP build, Linux (Debian / Ubuntu) and Buildroot, so Android publishing projects and Linux controller builds run on one board.
8. Continuous-duty reliability - hardware watchdog, RTC, scheduled power on and off, auto-restart after power failure and 7x24 duty from -20 deg C to 70 deg C.

Interactive Touch and Education Conference Boards Certifications, Electrical Performance and Assembly Notes

Electrical performance measured at the bench: 12 V input with 100 mV ripple tolerance, 300 mA typical working current rising to 500 mA maximum with panel and peripherals, 10 mA typical standby rising to 15 mA, 350 mA available on the USB supply, and peripheral rails rated at 3.3 V / 800 mA, 5 V / 2 A and 12 V / 2 A. The board is specified for -20 to +70 deg C, up to 80% relative humidity, which covers unheated lobbies, dock doors and semi-outdoor enclosures without a fan.

Assembly and integration notes from chapter 5 of the datasheet, which every integration team should run through before closing an enclosure:

• Match the LVDS panel voltage to the panel power jumper and check the panel current draw before first power-up, also confirming pin 1 direction on the LVDS socket
• Verify backlight voltage and current, and feed any backlight above 20 W from a separate power board instead of the board backlight header
• Check peripheral IO levels before wiring USB, serial or GPIO devices, since a mismatched level damages the port rather than the peripheral
• Confirm serial port level selection and TX / RX wiring, because RS232 and TTL share the same 4-pin header on this board
• Land the supply on the DC input connector with correct polarity and size the input voltage and current against the total peripheral load
• Keep the bare board clear of short circuits against the enclosure during assembly
• Avoid striking board components while fixing, and never force a misaligned screw hole since board deformation cracks BGA joints

Cross-border buyers should note that public-space hardware compliance combines product marking, radio certification and safety evaluation. For Singapore specifically, importers should confirm IMDA equipment registration and Safety Mark requirements before shipment. Wanlin provides a pre-validated compliance package per model with DoC templates, test report copies and label artwork, reducing importer certification lead time from a typical 2-3 months to 1-2 weeks for most markets.

Interactive Touch and Education Conference Boards Economics, MOQ, Lead Time and Logistics Math

For a first-time buyer ordering 1,000 pieces of the X9-IT150, the economics stack is:

Cost Layer	USD per piece	USD for 1000 pcs
FOB Shenzhen factory price	$71.00	$71000.00
+ Sea freight FCL 40HQ (estimated)	$3.40	$3400.00
CIF destination port	$74.40	$74400.00
+ Customs duty 3%-10% (region dependent)	$0.84	$842.84
+ Local delivery + warehousing	$5.60	$5600.00
DDP landed cost	$80.84	$80840.00

Interactive Touch and Education Conference Boards FAQ - OEM, ODM, MOQ, Lead Time, Partnership

Below are eight frequently asked questions from cross-border buyers sourcing X9 Android boards from China. Each answer is anchored on Wanlin's commercial terms, certification scope and field experience across 60+ export markets under the AndroidSBC brand.

What is the difference between OEM and ODM for Interactive Touch and Education Conference Boards?

Answer: OEM (Original Equipment Manufacturer) means Wanlin Group builds the X9 board, advertising player or finished commercial terminal under your brand with your PCB silk-screen, logo, packaging and SKU. ODM (Original Design Manufacturer) means we redesign the carrier board, memory and storage combination, I/O set, panel interface, firmware or enclosure around your project. Both run from the same Shenzhen factory and the same firmware team: OEM lead time is 18-25 days and ODM 25-40 days including pre-compliance checks. Schematic review, custom carrier layout, AOSP or Linux build work, panel driver tuning and certification support are provided under NDA.

Which X9 board should I source for my application?

Answer: Eight selection rules for cross-border buyers:

• (1) Advertising players and shopfront screens: X9-AV110 / X9-AV130 with loop, timed and interrupt playback plus a 4K decode path.
• (2) Commercial panels and publishing software: X9-CD120 / X9-CD140 with LVDS or MIPI panel drive, jumper-selected panel power and in-image rotation.
• (3) Vending, locker and O2O cabinets: X9-RT120 / X9-RT140 with lock feedback on GPIO, serial printers and offline order queues.
• (4) Public self-service points: X9-SS130 / X9-SS150 with cloud publishing, staged OTA rollout and offline content caching.
• (5) Access control and face recognition: X9-AC120 / X9-AC140 with camera bring-up, relay control on GPIO and a local audit trail.
• (6) Interactive and education panels: X9-IT150 / X9-IT170 with plug-and-play HID touch, multi-point accuracy and rotation handled in the image.
• (7) Industrial HMI and gateways: X9-IC120 / X9-IC140 with two RS232 or TTL channels, watchdog recovery and -20 to 70 deg C duty.
• (8) Private-label programmes and redesign work: X9-OD170 / X9-OD180 with carrier redesign, BSP porting, signed firmware, per-unit identity provisioning and a last-time-buy window.

What software support comes with the boards?

Answer: Every board ships with the Android 10 image alongside Linux support (Android 10 AOSP build, Linux (Debian / Ubuntu) and Buildroot), BSP source access, driver documentation, SDK material and OTA tooling. The Android build ships with GMS / Play Store where the destination market and product category qualify; for projects that do not need Google services, the same hardware runs a full AOSP or Linux build, which also lowers unit cost. Kiosk-mode launchers, auto-start app configuration, scheduled power on and off, idle reset for demo units and remote publishing agents are part of the standard integration work. Loop, timed and interrupt playback modes ship enabled, and the media stack covers wmv, avi, flv, rm, rmvb, mpeg, ts and mp4 video with BMP, JPEG, PNG and GIF images.

Can the board drive LVDS and MIPI panels and the full peripheral set?

Answer: Yes. Single LVDS direct drive at 50/60 Hz with a 15-pin 2.0 mm LVDS socket and 6-pin backlight header. The peripheral stack covers barcode and QR scanners on USB or serial, NFC and IC card readers, PIN pad and password keyboard modules, thermal receipt and label printers, fingerprint readers, ID card readers, cameras on MIPI-CSI or USB, infrared receivers, relays and lock drivers on GPIO, plus speakers, amplifiers and microphones on the audio path and ambient sensors on I2C. Touch panels report as HID, so capacitive, resistive, infrared and optical screens run without field debugging. Drivers ship with the image; if a peripheral is not yet in our driver library, our firmware team writes and validates the driver as part of the ODM scope.

What customization and partnership options does Wanlin offer?

Answer: Customization scope:

1. (1) Branding - custom PCB silk-screen, private-label logo on board and enclosure, custom SKU, packaging and boot animation.
2. (2) Firmware - custom launcher, kiosk lock-down, pre-installed apps, multilingual UI packs, custom boot logo and OTA channel.
3. (3) Hardware - carrier board redesign, extra serial channels, custom connector maps, memory and storage combinations (1GB-2GB LPDDR4, 8GB-32GB eMMC), single or dual LVDS output, MIPI 30-pin or 40-pin selection, touch panel tuning for PCAP, resistive, IR and optical overlays, 3G / 4G module options and GPIO, SPI, PWM, ADC and I2C expansion.
4. (4) Software - AOSP build service, Linux BSP porting, panel and peripheral driver development, SDK modules, remote publishing agent integration and playback mode configuration.
5. (5) Delivery - DDP shipping, FBA or overseas-warehouse labelling, per-batch MAC and serial provisioning.

Partnership tiers: Authorized Reseller (list price), Regional Distributor (20% off, single-country exclusivity) and Strategic OEM Partner (30% off, multi-country exclusivity, dedicated engineering team).

Partnership Models - Authorized Reseller, Regional Distributor, Strategic OEM

Wanlin offers three partnership tiers for cross-border buyers of Interactive Touch and Education Conference Boards:

Conclusion - How to Start Your Interactive Touch and Education Conference Boards Sourcing Today

Wanlin Group's 2026 X9 export program is open to B2B buyers, regional distributors, cross-border traders and OEM/ODM partners in Singapore and 60+ destination markets. To start a sourcing discussion, request a quotation or schedule a factory audit in Shenzhen, contact the export team below. Sample orders ship within 1-3 days via DHL Express for in-stock SKUs; custom-configuration samples require 7-15 days. Standard lead time for bulk OEM orders is 18-25 days, and Strategic OEM Partner applications are reviewed quarterly.

We invite Singapore buyers, export traders and trading companies to build long-term cooperation with Wanlin Group as your China-based OEM/ODM partner, regional exclusive distributor or strategic global supplier under the AndroidSBC brand. Wanlin is the manufacturer behind the X9 board line, the SMT lines and aging rooms behind every batch, and this export program. Let's build the Interactive Touch and Education Conference Boards supply chain together.

• Wanlin Group, Building B, Building 1, Beisida Medical Device Building, 28 Nantong Avenue, Baolong Community, Baolong Sub-district, Longgang District, Shenzhen, Guangdong, China
• Manufacturer: Wanlin Group / Brand: AndroidSBC / Site: www.androidsbc.com
• Export service: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com
• Form factor: Interactive Panel Boards / Platform: Allwinner A133 quad-core SoC (X9 board platform) / PCB: 6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes
• Country compliance for Singapore: IMDA equipment registration and Safety Mark requirements