Wanlin Group · WanlinSBC · RK3588 custom storage configuration Italy Pro for Italy Buyers - Wholesale RK3588 Turnkey OEM ODM Pr
RK3588 custom storage configuration Italy Pro for Italy Buyers - Wholesale RK3588 Turnkey OEM ODM Pr
RK3588 custom storage configuration RK3588 Turnkey OEM ODM Program Italy export OEM ODM wholesale
RK3588 custom storage configuration Italy Pro for Italy Buyers - Wholesale RK3588 Turnkey OEM ODM Pr
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Details
From September 12, 2026, the WF-RK3588-TK130 from Wanlin Group (Shenzhen, China) is available to Italy buyers under the factory's 2026 RK3588 Turnkey OEM ODM Program export program, Triple-core NPU, 16GB LPDDR4X, 128GB eMMC + Hardware 8K@60fps H.265 / VP9 / AV1 decode, Android 12 / 13 / 14 with Linux (Debian / Ubuntu) and OpenHarmony support: RK3588 Turnkey OEM ODM Program, WF-RK3588-TK130, Turnkey OEM ODM Program, 16GB LPDDR4X + 128GB eMMC, with turnkey OEM/ODM board programs, configured to the needs of RK3588 Turnkey OEM ODM Program. Wanlin Group as the RK3588 Turnkey OEM ODM Program device supplier, exporter and original manufacturer now serves local partners, regional exclusive distributors and strategic OEM clients in more than 60 destination markets, and the RK3588 Turnkey OEM ODM Program program is open to Italy buyers ordering at factory-direct terms.
Core parameters: Rockchip RK3588 octa-core SoC, 8 nm process, integrated 6 TOPS NPU. CPU 4x Cortex-A76 @ 2.4 GHz + 4x Cortex-A55 @ 1.8 GHz, big.LITTLE architecture. GPU Mali-G610 MP4 GPU, OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2. NPU Triple-core NPU, 6 TOPS INT8, INT4 / INT8 / INT16 / FP16 / BF16 / TF32 mixed precision. Video decode Hardware 8K@60fps H.265 / VP9 / AV1 decode, 8K@30fps encoding, dual-display output. ISP 48 MP ISP image processor, multi-camera input pipeline. Memory and storage 16GB LPDDR4X + 128GB eMMC. Operating system Android 12 / 13 / 14 with Linux (Debian / Ubuntu) and OpenHarmony support. Display output HDMI 2.1 (8K@60) + DP 1.4 + eDP + dual / triple / quad independent display. Interfaces and I/O USB 3.0 x2 + USB 2.0 x2, Mini PCIe / M.2 NVMe, SATA 3.0, UART / GPIO / I2C / SPI / CAN-FD. Networking Dual Gigabit Ethernet + WiFi 6 (802.11ax) + Bluetooth 5.3 + 4G / 5G M.2 module. Power input DC 12 V input, 9-36 V wide-voltage on industrial SKU. Operating temperature 0 to 70 deg C commercial, -20 to 70 deg C extended, -40 to 85 deg C industrial. Board dimensions 3.5-inch SBC / Pico-ITX / Mini-ITX / SOM stamp-hole variants. Certifications CE / FCC / RoHS / REACH. Wanlin's 2026 export roadmap for Italy also covers custom memory and storage combos, dual-OS Android and Linux images, private-label branding and per-destination certification documentation packages.
Global RK3588 Turnkey OEM ODM Program Market Overview and 2026 Buyer Demand
In-country certification support (CE, FCC, KC, PSE, SAA) is the most requested turnkey service add-on, appearing in 8 of 10 cross-border programs, Custom packaging and retail-ready documentation requests doubled in 2025 as turnkey buyers moved into brick-and-mortar channels.
Regional compliance for Italy is anchored on CE under RED 2014/53/EU, EMC and RoHS declarations with Italian-language user documentation. Cross-border buyers are advised to verify the certification scope and software build of every board before import, since some China-supplied boards ship without destination radio approval or without the licensed Android build the project actually needs, and either gap can stall customs clearance or store audits.
Reference: Omdia 2025 market research, Rockchip RK3588 official datasheet, Wanlin Group 2026 export program documentation.
RK3588 Turnkey OEM ODM Program Engineering Architecture and Hardware Platform
Three sub-modules define the engineering depth:
- SoC and NPU module - Rockchip RK3588 octa-core SoC, 8 nm process, integrated 6 TOPS NPU. 4x Cortex-A76 @ 2.4 GHz + 4x Cortex-A55 @ 1.8 GHz, big.LITTLE architecture handles sustained AI inference and UI workloads in fanless enclosures.
- Video, display and ISP module - Hardware 8K@60fps H.265 / VP9 / AV1 decode, 8K@30fps encoding, dual-display output. 48 MP ISP with multi-camera input, HDMI 2.1 (8K@60) + DP 1.4 + eDP supports panel-direct and HDMI deployments with up to quad independent displays.
- Software, AI toolchain and management module - Android 12 / 13 / 14 with Linux (Debian / Ubuntu) and OpenHarmony support. RKNN Toolkit2, RKNPU2 SDK, RKLLM Toolkit, OTA upgrade, boot logo customization, pre-installed app support and launcher customization enable the AI ecosystem and remote management for fleets.
Featured Model - WF-RK3588-TK130 Pro Technical Signature
The unique technical signature of WF-RK3588-TK130 on this configuration is documented below. Every parameter is engineering-verified by our Shenzhen lab and cross-checked against the display panel specifications of mainstream LCD vendors and the safety limits of IEC / UL 62368-1.
| Specification | Value |
|---|---|
| soc_platform | Rockchip RK3588 octa-core SoC, 8 nm process, integrated 6 TOPS NPU |
| cpu_core | 4x Cortex-A76 @ 2.4 GHz + 4x Cortex-A55 @ 1.8 GHz, big.LITTLE architecture |
| gpu_3d | Mali-G610 MP4 GPU, OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2 |
| npu_ai | Triple-core NPU, 6 TOPS INT8, INT4 / INT8 / INT16 / FP16 / BF16 / TF32 mixed precision |
| video_decode | Hardware 8K@60fps H.265 / VP9 / AV1 decode, 8K@30fps encoding, dual-display output |
| isp_image | 48 MP ISP image processor, multi-camera input pipeline |
| memory_storage | 16GB LPDDR4X + 128GB eMMC |
| os_android | Android 12 / 13 / 14 with Linux (Debian / Ubuntu) and OpenHarmony support |
| display_out | HDMI 2.1 (8K@60) + DP 1.4 + eDP + dual / triple / quad independent display |
| interfaces_io | USB 3.0 x2 + USB 2.0 x2, Mini PCIe / M.2 NVMe, SATA 3.0, UART / GPIO / I2C / SPI / CAN-FD |
| networking | Dual Gigabit Ethernet + WiFi 6 (802.11ax) + Bluetooth 5.3 + 4G / 5G M.2 module |
| power_input | DC 12 V input, 9-36 V wide-voltage on industrial SKU |
| operating_temp | 0 to 70 deg C commercial, -20 to 70 deg C extended, -40 to 85 deg C industrial |
| board_dimension | 3.5-inch SBC / Pico-ITX / Mini-ITX / SOM stamp-hole variants |
| use_case | turnkey OEM/ODM board programs |
RK3588 Turnkey OEM ODM Program Application Scenarios across Deployment Sites
The scenarios below are drawn from actual RK3588 Turnkey OEM ODM Program deployment records, with site, fleet size and quantified results for each.
Scenario 1: turnkey program for education NGO (Johannesburg, South Africa). an education NGO required a turnkey lab-computer board with a custom Ubuntu image, a low-power build and a custom offline content sync tool. Measured result: the offline sync tool worked over 2G-class links and lab uptime reached 97% despite intermittent power.
Scenario 2: turnkey program for AV startup (Amsterdam, Netherlands). a European AV startup handed Wanlin a complete turnkey brief: custom carrier design, branded enclosure fit, an Android image with custom launcher, certification documents and a dropship fulfillment flow; Wanlin ran the whole program from schematic review to container loading. Measured result: the program ran schematic to pilot shipment in 11 weeks and the startup skipped building a hardware team entirely and hit retail launch on schedule.
Scenario 4: turnkey program for marine electronics (Vancouver, Canada). a marine-electronics brand required a turnkey board with coated PCBA, a custom chart-data decoder and marine-market documentation. Measured result: coated PCBA passed 1,000 h salt-fog testing and the brand retired its legacy in-house board line entirely.
Scenario 5: turnkey program for solar monitoring firm (Madrid, Spain). a solar-monitoring firm required a turnkey board with custom RS485 inverter bridges, a wide-temp build and a custom data-platform onboarding kit. Measured result: custom inverter bridges validated across 5 inverter brands and onboarding time for new sites fell from 3 h to 25 min.
AndroidSBC RK3588 Turnkey OEM ODM Program Competitive Advantages for Cross-Border Buyers
The RK3588 Turnkey OEM ODM Program and the broader AndroidSBC RK3588 portfolio deliver eight distinct advantages for cross-border B2B buyers sourcing NPU boards directly from Chinese manufacturers:
- Source-factory pricing - Wanlin operates the SMT lines, so FOB Shenzhen pricing runs 20-30% below discrete GPU edge boxes and 35-50% below western-branded x86 industrial PCs.
- 6 TOPS NPU silicon - Rockchip RK3588 triple-core NPU, 6 TOPS INT8, INT4 / INT8 / INT16 / FP16 / BF16 / TF32 mixed precision, engineered in Shenzhen rather than rebadged from a broker.
- Hardware 8K@60fps H.265 / VP9 / AV1 decode - Hardware 8K@60fps H.265 / VP9 / AV1 decode, 8K@30fps encoding, dual-display output, at a cost point set for volume NPU deployments.
- Full display interface coverage - HDMI 2.1 (8K@60) + DP 1.4 + eDP + dual / triple / quad independent display, supporting panels from 7 to 86 inches with factory panel-config and backlight driver onboard.
- Multi-OS flexibility - Android 12 / 13 / 14 with Linux (Debian / Ubuntu) and OpenHarmony, RKNN Toolkit2 and RKLLM Toolkit serves both app-driven and Linux-BSP projects from one board.
- Custom memory and storage - 4GB-32GB LPDDR4X / LPDDR5, 32GB-256GB eMMC + NVMe SSD, matching image size and workload to deployment need.
- ODM depth - carrier board redesign, custom I/O, custom enclosure, AOSP / OpenHarmony build, Linux BSP porting, RKNN model conversion and YOLO optimisation from one factory.
- Continuous-duty reliability - hardware watchdog, RTC, scheduled power on/off, auto-reboot and industrial-grade screening for commercial and industrial duty.
RK3588 Turnkey OEM ODM Program Certifications, Standards Route and Regional Compliance
Cross-border buyers should note that board compliance is a combination of product marking, radio certification, safety evaluation and - where Play Store distribution is required - Google GMS licensing. For Italy specifically, importers should confirm CE under RED 2014/53/EU, EMC and RoHS declarations with Italian-language user documentation before shipment. Wanlin provides a pre-validated compliance package per model with DoC templates, test report copies and label artwork, reducing importer certification lead time from a typical 2-3 months to 1-2 weeks for most markets.
RK3588 Turnkey OEM ODM Program Board Economics, MOQ, Lead Time and Logistics Math
For a first-time buyer ordering 1,000 pieces of the WF-RK3588-TK130, the economics stack is:
| Cost Layer | USD per piece | USD for 1000 pcs |
|---|---|---|
| FOB Shenzhen factory price | $213.00 | $213000.00 |
| + Sea freight FCL 40HQ (estimated) | $5.10 | $5100.00 |
| CIF destination port | $218.10 | $218100.00 |
| + Customs duty 3%-10% (region dependent) | $1.06 | $1062.06 |
| + Local delivery + warehousing | $8.20 | $8200.00 |
| DDP landed cost | $227.36 | $227360.00 |
RK3588 Turnkey OEM ODM Program FAQ - OEM, ODM, MOQ, Lead Time, Partnership
Below are eight frequently asked questions from cross-border buyers sourcing RK3588 Turnkey OEM ODM Program boards from China. Each answer is anchored on Wanlin's actual commercial terms, certification scope and field experience across 60+ export markets under the AndroidSBC brand.
What is the difference between OEM and ODM for RK3588 Turnkey OEM ODM Program boards?
Answer: OEM (Original Equipment Manufacturer) means Wanlin Group builds the RK3588 Turnkey OEM ODM Program board, core board or finished device under your brand with your PCB silk-screen, logo, packaging and SKU. ODM (Original Design Manufacturer) means we redesign the carrier board, memory/storage combo, I/O set, firmware or enclosure around your project. Both run from the same Shenzhen factory and the same BSP team: OEM lead time is 30-45 days and ODM 30-45 days including pre-compliance checks. Schematic review, custom carrier layout, AOSP or Linux build work and certification support are provided under NDA.
Which RK3588 Turnkey OEM ODM Program form factor should I source for my application?
Answer: Eight selection rules for cross-border buyers:
- (1) Edge AI box / inference appliance: WF-RK3588-EA110 / EA120 with the 6 TOPS NPU pipeline and dual GbE.
- (2) Robotics / AGV / AMR / quadruped: WF-RK3588-RB130 / RB140 with ROS2 stack and EtherCAT support.
- (3) Industrial control / machine vision: WF-RK3588-IC150 / IC160 with wide-temperature and 36-month warranty.
- (4) Smart NVR / multi-channel AI video: WF-RK3588-NV140 / NV170 with SATA RAID and PoE support.
- (5) Smart cockpit / IVI / fleet telematics: WF-RK3588-AC160 / AC180 with CAN-FD and 5G M.2.
- (6) 8K digital signage / multi-screen video wall: WF-RK3588-DS120 / DS130 with HDMI 2.1 8K and triple display.
- (7) Self-service kiosk / POS / vending / parcel locker: WF-RK3588-SK140 / SK150 with on-device vision and 4G.
- (8) ARM PC / mini PC / thin client / NAS: WF-RK3588-PC110 / PC130 with NVMe and dual-display.
What software support comes with the boards?
Answer: Every form factor ships with Android and Linux images, BSP source access, SDK documentation and OTA tooling. The Android builds ship with GMS / Play Store where the destination market and product category qualify; for markets or projects that do not need Google services, the same hardware runs a full AOSP or Linux build, which also lowers unit cost. Wanlin manages the approval paperwork against your brand and hands over the listing evidence before mass production. RKNN Toolkit2, RKNPU2 SDK and RKLLM Toolkit are bundled for NPU model deployment and on-device LLM inference.
Can the same board run Android and Linux, and how does the NPU toolchain work?
Answer: Yes. Every RK3588 Turnkey OEM ODM Program form factor ships Android images alongside Linux support (Debian, Ubuntu and OpenHarmony builds). Dual-OS means we can flash Android to the onboard eMMC and provide a Linux image for TF-card boot, or ship a dual-partition image that selects the OS at power-up. For industrial and gateway projects we pre-load a Linux BSP with device tree, drivers and SDK; for retail, signage and display projects the default image is Android with the launcher, CMS agent or desktop client you specify. The NPU toolchain covers ONNX, PyTorch, TensorFlow, Caffe and TFLite model conversion to RKNN, INT8 mixed-precision quantization, RKNN API and RKNPU2 SDK, plus the RKLLM Toolkit for on-device LLM inference.
What customization and partnership options does Wanlin offer?
Answer: Customization scope:
- (1) Branding - custom PCB silk-screen, private-label logo on board and enclosure, custom SKU and packaging.
- (2) Firmware - boot logo, boot animation, pre-installed apps, custom launcher, locked-down kiosk builds.
- (3) Hardware - carrier board redesign, custom I/O, memory and storage combos (4GB-32GB LPDDR4X / LPDDR5, 32GB-256GB eMMC + NVMe), WiFi/BT module selection, 4G/5G radio options, CAN-FD expansion.
- (4) Software - AOSP build service, Linux BSP porting, OpenHarmony porting, SDK module development, OTA server setup, RKNN model conversion and YOLO optimisation.
- (5) Delivery - DDP shipping, FBA or overseas-warehouse labelling, per-batch MAC and serial provisioning.
Partnership Models - Authorized Reseller, Regional Distributor, Strategic OEM
Wanlin offers three partnership tiers for cross-border RK3588 Turnkey OEM ODM Program board buyers:
Conclusion - How to Start Your RK3588 Turnkey OEM ODM Program Sourcing Today
Wanlin Group's 2026 RK3588 Turnkey OEM ODM Program board export program is open to B2B buyers, regional distributors, cross-border traders and OEM/ODM partners in Italy and 60+ destination markets. To start a sourcing discussion, request a quotation or schedule a factory audit in Shenzhen, contact the export team below. Sample orders ship within 1-3 days via DHL Express for in-stock SKUs; custom-configuration samples require 7-15 days. Standard lead time for bulk OEM orders is 30-45 days, and Strategic OEM Partner applications are reviewed quarterly.
We invite Italy buyers, export traders and trading companies to build long-term cooperation with Wanlin Group as your China-based OEM/ODM partner, regional exclusive distributor or strategic global supplier under the AndroidSBC brand. Wanlin is the manufacturer behind 60+ country board projects, the SMT lines and aging rooms behind every batch, and this export program. Let's build the RK3588 Turnkey OEM ODM Program board supply chain together.
- Wanlin Group, Building B, Building 1, Beisida Medical Device Building, 28 Nantong Avenue, Baolong Community, Baolong Sub-district, Longgang District, Shenzhen, Guangdong, China
- Manufacturer: Wanlin Group / Brand: AndroidSBC / Site: www.androidsbc.com
- Export service: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com
- Form factor: Turnkey OEM ODM Program / Chip: Rockchip RK3588 octa-core SoC / NPU: 6 TOPS INT8
- Country compliance for Italy: CE under RED 2014/53/EU, EMC and RoHS declarations with Italian-language user documentation
Publishing and verification
Published by Wanlin Group under the WanlinSBC identity. Product capabilities must be confirmed against the exact model, PCB revision, software build and current controlled document before procurement or integration.
Availability, certification scope, pricing, lead time and lifecycle commitments depend on the selected configuration and written project agreement.
